Semiconductor Services,Chip Design Services,Chip Assembly,Chip Verification Solution




Electronic Design
PCB Layout
DFM and Engineering Services
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Chip Design Services
Chip Verification
Silicon Wafers
Dicing Services
Chip Assembly


	Semiconductor Services


	Chip Design services : We are capable of offering end-to-end IC design and layout services along the design chain, with extensive experience in designing a variety of analog/ mixed- signal modules, Full-chip design and layout integration of high performance mixed signal ICs and addressing issues related to substrate/supply noise, latch-up, pin-outs/packaging etc and exposure to silicon debussing. We experience in industry standard design and SIM tools from Cadence/ Synopsys/ Mentor Chip Verification Solution Aytera Chip verification services specializes in design and verification services using advanced methodologies. Our team is based on talented developers, all with Bsc or Engineering degree in computer science. This allows us to provide high-level work ethics and high quality products. Our development center is customer oriented, answering to each customer's unique needs and requirements. Our management team has an extensive technical background, in a wide variety of projects, which was gained while working at Infineon-Savan, Flexlight-Networks, Verisity (Cadence), Mindspeed (Conexant), 3com, Nortel, Wavion, Dblur, Emblaze and more.

	Silicon Wafers Aytera International, Inc. (AII) is a first-rate supplier of silicon wafers, semiconductor materials and wafer processing services. Our mission is simple: providing our customers with superior service and exceptional quality. Our goal is to provide all of our customers' needs for silicon wafers and custom process services.

	Dicing Services Fully Automatic World Class Wafer Dicing systems handle wafers ranging from fragments to 300mm diameter. Wafer cleanliness is maintained with surfactant injected into the DI water system and ESD is eliminated with CO2 bubblers and anti-static ionized workstations. Our experienced operators can take your multiple die type wafers with complex dicing patterns and save all dice or sacrifice some to retrieve the most important. No two-customer products are alike and each product wafer will be diced with specially customized program parameters to minimize yield loss. Our narrowest cut line can be as low as 15 µm. Our engineering research has isolated root causes of die chipping, which causes low die strength and poor yields. Our ability to dice with parameters optimized to each individual customer's device has led us to success and technical leadership in the industry for chip-free, high-volume wafer dicing.
	Chip Assembly Aytera partners with customers to provide them with the highest-quality IC assembly services to achieve their goals. We help companies introduce their new products to market in the fastest time possible by providing high quality, quick-turn assembly. Aytera assembles ICs in prototype and production volumes to help you qualify your designs and provide quality samples to your customers. Aytera understands that time is of the essence in this fast-paced technology. We use state-of-the-art machines in our facility to support and turn many different types of IC assemblies in as quickly as 4 hours. Our flexibility in meeting customer requirements and our superior customer service separate us from all other assembly subcontractors worldwide!

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